bonder

Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.

基于解析模型的方法, 研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律.

The automatic wire bonder is one of the primary equipments in semiconductor back-end production.

自动金丝球焊机是半导体制造后端工序的关键设备之一,图像识别系统是其核心技术.

This product design for IC assembly die bonding process on die bonder machine.

本产品是为IC封装自动贴片机及其贴片工艺而设计.

Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

To create new bonder business mode for new customer.

为新客户创建新的保税贸易模式.

The device can replace the manual machine, and provide an equipment of varies die bonder.

该装置可取代手动装置, 为各种粘片机提供配套设备.

The X-Y table aquires the accuracy 5 μ m to ensure the exact positions of bonder spots.

X -Y工作台要求实现精度达5μm,以便保证各焊点的精确位置.

There is some additional function, such as generating reports from summary of bonder data.

还有一些附加的功能比如统计机台的各项参数然后生成报表.

This product design for IC assembly die attache process on die bonder machine.

本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计.

The auto Die Bonder for SOT-23 transistor is a high-speed , high-precision, machinery electronics integrated equipment.

SOT-23晶体管封装自动键合机是 高速 、 高精度机电一体化精密设备.