I have a number of things to do today.

Employees should have a voice in the decision-making process.

雇员在决策的过程中应该有发言权。

Students have a free choice of courses in their final year.

学生在最后一学年可以自由选修课程。

You have a strong case for getting your job back.

你有充分的理由要求恢复你的工作。

How much are these? They don't have a price on them.

这些东西卖多少钱？它们都没有标价。

Every file on the same disk must have a different name.

同一磁盘上的每一个文件都必须有不同的文件名。

Come off it! We don't have a chance.

别胡扯了！我们没机会。

Did you have a good day?

你这一天过得顺利吗？

Did you have a good time in London?

你在伦敦过得愉快吗？

We have a buyer who would like to view the property.

我们有一买主想看看这房产。

I'll have a think and let you know tomorrow.

我要好好想一想，明天告诉你。

We would often have a walk of an evening.

我们过去常在晚上散步。

Did you have a good time in Spain?

你在西班牙过得愉快吗？

The self-alignment mechanism of flip chip bonding can improve the precision and repeatability of laser coupling.

而透过覆晶封装自动对准的优点,可以改善雷射封装位置的准确性.

Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性.

The purpose of this thesis is to apply dry film photo-resist for high frequency flip-chip packaging .

本论文研究的方向是将乾膜 光阻 应用于高频 覆晶封装 上.

To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip-chip bonding.

热超声倒装键合作为前沿封装技术具有良好的发展前景.

The sensor chip is flip-chip packaged on a thin ceramic substrate using copper pillar bump technology.

该传感器使用铜柱凸点技术,倒装于薄层陶瓷上.

In summary, dry film photo-resist was applied to the wafer level high frequency flip-chip packaging process.

总结来说, 本文证实乾膜光阻适用于晶圆级高频 覆晶封装 制程.

In the aspect of dispersion for power LEDs, flip-chip configuration has potential predominance.

与正装LED相比, 倒装焊芯片技术在功率型LED的散热方面具有潜在的优势.

With the development of IC packaging technology, flip chip is widely used.

随着集成电路封装技术的发展, 倒装芯片技术得到广泛的应用.