Through the reliability test, the NTC CUP process is suitable for thinner bond wire. So we can reduce the cost of the product which is lower driving current through wafer process change.

  • 通过可靠性试验的研究发现,NTC的CUP工艺,在目前情况下只适用于线径较细的焊接工艺,因而可以对一些驱动电流较低的产品进行芯片工艺改进,降低芯片成本。

  • 互联网摘选 2025-01-20 13:06:11

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