But when the circuit is converted into CNF, the structure information is lost.

The CNF development and changes in every period are different.

在每个时期,其发展与变化都有所不同.

If we can find a better price than you, why don't we do CNF.

如果我们能比你找到更好的价格, 为什么我们不做CNF呢.

The functions of CnF in connection with pain and analgesia were disscussed in this paper.

本文还讨论了CnF参与痛与镇痛的形态学基础.

Results The diagnostic sensitivity was 95.38 % and specificity was 100 %. The false negative rate was 1.38 %.

结果弹射式空芯针活检(ST-CNB)对乳腺癌的诊断敏感性为95.38%,特异性为100%, 假阴性率为1.38%,假阳性率为0.

A systemic tree was made with part of CP gene sequences of CMV strains or isolates.

本研究选取了部分CMV株系 或分离物的CP基因序列绘制了CMV的 系统树.

In the trial phase, neither group received any antivirus therapy unless CMV diease were diagnosed.

试验阶段除发生临床确诊的CMV病,各组不使用任何抗病毒治疗.

This paper summarizes the progress of genomic structure andCMV and genetic tobacco resistant to CMV.

该文主要介绍了黄瓜花叶病毒的基因组结构、亚组以及抗CMV的烟草基因工程的研究进展.

Combined machining technology ( CMT ) is a advance manufacturing technology which rose in the end of 20 thcentury.

复合 加工技术 是20世纪末期兴起的一门先进制造技术.

The photos are provided to CONEXPO Asia courtesy of Construction Machinery Today ( CMT ) .

照片由展会指定的摄影方《今日工程机械》 杂志社 提供.

However, the pressure response of CMT is mainly affected by the initial temperature of CMT.

实验发现,CMT内 温度分布和凝结特性主要受PRZ初始 压力和CMT初始温度的影响, 而压力响应主要受CMT初始 温度影响.

In drain experiments, the drain mass increased with PRZ initialpressure and initial temperature of CMT.

在排水实验中, 排水量随着PRZ初始压力的升高而增加,随着CMT初始温度的增加而增加.

To explore the complementary capacities between two systems, character matching rate ( CMR ) is defined first.

首先定义了字符匹配率用以反映两系统在某个识别正确率上的 互补 能力.

But finished-products of CMR MOSFETs havn ` t gone to market.

成品 巨磁阻 场效应晶体管(CMRMOSFETs)目前尚未见市场化.

What's the value of the steam consumption of this turbine at CMR?

这台汽轮机在连续最大功率工况下,汽耗量是多少?

But finished-products of CMR MOSFETs havn't gone to market.

成品 巨磁阻 场效应晶体管(CMRMOSFETs)目前尚未见市场化.

The CMR effect of the thin films was investigated.

研究了La_ (1-x) Te_ xMnO_3薄膜的CMR效应.

The Chemical mechanical polishing technique in the field of semiconductor industry was introduced.

介绍了半导体工业中蓬勃发展的化学机械抛光(CMP)技术.

The major problem in Cu CMP is dishing, serious dishing will cause the yield loss.

铜化学机械抛光是近些年发展最快的一种工艺,铜碟形是铜化学机械抛光工艺中的主要问题之一.

Under the optimal conditions, about 45.7 % CMP was transformed to CTP.

在最优化条件下, 转化率达45.7%.

The presented parallel algorithms can be referred in designing CMP system and optimizing other applications.

这些算法的提出,为今后CMP系统的设计以及其他应用在CMP体系结构上的并行优化提供了参考.