With the theoretical analysis, the computer simulation and the process experiment methods, this paper studies the liquid forming mechanism of silicon wafer for ELCC technology and makes provision for further research on the solidification microstructure control of the silicon sheet.

  • 采用理论分析、计算机模拟与工艺实验相结合的方法,对ELCC技术硅片液态成形机制进行了研究,为进一步对硅片凝固过程组织控制的研究奠定基础。

  • 互联网摘选 2025-01-20 17:17:05

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