or DRAM ( computer memory chips)." XMC, however, is developing today's leading-edge 3D NAND chips to be test-ready by the end of this year, said Hui He, a senior analyst for China's semiconductor market at IHS Technology.

  • 不过,IHS公司半导体行业的资深分析师何慧却表示,目前武汉新芯已经在研制高水平3D NAND闪存芯片,即将在今年年末投入测试。

  • 互联网摘选 2025-01-20 17:33:13

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