The Failure Rate Function of Weibull Distribution in Progressive Stress Life Testing for the TFR, TRV and CE Models

Therefore testing circuits are more flexible for different TRV requirements, especially for special test conditions required by the utilities.

这样，就可使试验回路对不同的TRV要求，特别是电力部门提出的特殊试验条件更为灵活。

Study on Transient Recovery Voltage ( TRV) of Filter DC Breaker in HVDC Converter Station

换流站滤波器断路器暂态恢复电压的研究

Analysis of Two-parameter TRV and Calculation of Circuit Parameters in Short-circuit Test

断流容量试验回路中二参数瞬态恢复电压的分析及回路参数的计算

We report that either by syringe-infiltrating the TRV-vector into the surface, stem or carpopodium of a tomato fruit attached to the plant or by vacuum-infiltrating into a tomato fruit detached from the plant, TRV can efficiently spread and replicate in the tomato fruit.

通过离体番茄果实的真空渗透，活体果实的果实表面，果柄和果茎注射等方式侵染番茄果实，烟草脆裂病毒在番茄果实中能有效的复制和转移。

Trx plays crucial roles in regulating cell growth, apoptosis and gene transcription.

Trx具有调节细胞生长、抑制凋亡、调节基因转录等功能。

These studies have shown that: TRX can suppress tumor cell apoptosis.

研究表明：TRX可以抑制肿瘤细胞凋亡。

Sequence analysis verified that the sequence of the cloned cDNA is identical to that of rat TRX cDNA in Genbank.

序列分析表明，克隆所得序列与GenBank中大鼠硫氧还蛋白cDNA序列完全一致。

Trx has various biological functions in keeping stable redox status of cells.

硫氧还蛋白具有多种生物学功能，对维持体内稳定的氧化还原状态具有重要的作用。

Among them, TSF torque control scheme based on modified multi-level converter is research emphasis.

其中，重点研究了基于改进型多电平功率变换电路的TSF转矩脉动最小化问题。

Foaming agent TSF for air drilling: a laboratory study

空气钻井用发泡剂TSF的研制

Application of TSF Guide Soft Belt to Heavy Machine Tools

TSF导轨软带在重型机床上的应用

TSF algorithm for analysis of the effect of a shielding box

TSF算法及其在机箱屏蔽效应分析中的应用

In addition to bank loans, TSF included newer categories such as trust lending, entrusted loans or credits between companies and bankers' acceptances, to name a few items.

除了银行贷款，社会融资总量还包括信托贷款、委托贷款和银行承兑汇票等新类别。

Since its introduction, the TSF measure has faced plenty of controversy in academic circles.

自推出以来，社会融资总量在学术界面临诸多争议。

TSV technology mostly used the ICP-RIE process, and using MEMS technics in future main packaging would speed up MEMS industry.

TSV技术主要采用ICP-RIE工艺，将MEMS技术应用于未来的主流封装技术将会进一步加快MEMS产业的速度。

Considered factors of the cost, precision control and so on, dry process is generally used to fabricate TSV.

考虑到成本，精度控制等因素，一般倾向于使用干法刻蚀来制作TSV。

Among them, TSV is a very key process.

TSV的形成是其中很关键的一个工序。

TSV ( Through Silicon Via) is a new interconnected technology that used in high density 3-dimensional packaging.

硅通孔（Through Silicon Via，TSV）技术是一种应用于高密度三维封装中的新兴互连技术。

The TSX Venture Exchange does not accept responsibility for the adequacy or accuracy of this release.

TSX创业交易所不接受的充分性或本新闻稿准确性负责。

This car was later released in the US as the Acura TSX.

这款车后来被释放在美国的阿库拉TSX。