Results: 1 QKT high dose group and QKT low dose group can prolong the cough incubation period in mice.

Elementary analysis and calculation of the QKT 50D drill's hydraulic system design

浅析QKT50D型钻机液压系统结构设计与计算

She should shave more often, but there didn't seem much point to it.

她应该更经常地剃剃汗毛, 不过好像也没什么意思.

People are dying of cancer more and more often.

死于癌症的人越来越多了.

As often as I tried to phone him the line was engaged.

每次我给他打电话都占线.

As often as he's tried to go there, he's always failed.

每次他争取去那里都未能成行.

Buy fresh produce as often as possible.

尽量常买新鲜农产品。

Conclusion It is helpful to predicting the occurrence of delayed brain disease following acute COP by measuring constantly the PNO level of patients.

结论动态观察急性CO中毒后病人血浆NO变化有助于预测迟发性脑病的发生。

Anomalous zero field splitting in ( pno) cucl · h 2O crystal

（pno）CuClH2O的反常零场分裂

The Relationship between Plasma Nitric Oxide ( PNO) and Delayed Brain Disease Following Acute Carbon Monoxide Poisoning

一氧化碳中毒患者血浆NO含量与迟发性脑病的关系

Study on Clinical Significance and Impact on Prognosis of Blood Micrometastasis in pNo Period Esophageal Squamous Cell Carcinoma

pNo期食管鳞癌血液微转移临床意义及预后研究

Analysis on Thermal-mechanical Stress and Moisture Driven Delamination in the QFN Package Devices

热–机械应力和湿气引起QFN器件层间开裂分析

Effects of Moisture on the Reliability of QFN Device in Hygro-Thermal Environment

湿热环境下吸潮对QFN器件可靠性的影响研究

Study on Interface Delamination of QFN under Thermal Shock Loading Based on CZM Method

基于CZM法QFN器件热冲击载荷下的界面脱层研究

Finite element analysis on soldered joint reliability of QFN device

QFN封装焊点可靠性的有限元分析

Influence of EMC Material Property Parameters on Thermal Stress of QFN

EMC材料特性参数对QFN器件热应力的影响

Reliability sensitivity analysis of the QFN device based on Monte Carlo method

基于蒙特卡罗法的QFN器件可靠性灵敏度分析

Thermal Reliability Analysis for QFN based on Factorial Experimental Design

基于析因实验设计的QFN热可靠性分析

Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL.

主要研究了不同氧含量对QFP引脚焊点拉伸强度的影响，得到一个最佳的氧含量范围。

Mechanical properties and microstructures of QFP micro-joints soldered with diode-laser soldering system

QFP器件半导体激光钎焊焊点力学性能和显微组织

The 3D shape prediction models and the 3D finite element analysis models of all the 25 QFP solder joints were developed.

建立了这25种焊点的三维形态预测模型和三维有限元分析模型；