From now on, I will confer Iwama-ryu certificates to all Iwama-ryu students.

South Korean Ryu Seung Min beat China's Wang Hao in the men's singles final.

韩国选手柳承敏在男子单打决赛中击败了中国选手王皓.

Remark: Please contact our technical department if you need more technical index.

备注: 如需产品其他性能,请与公司产品技术部联系.

Note: Customers in abroad, please contact foreigndepartment not to contact factory office.

备注: 国内客户请与工厂邓先生联系.

Remark: This machine can fIt'servo system that make efficiency reach to 50 %.

备注: 本机型可选配伺服控制系统,整机性能加工效率可提高50%.

For service temperature range and a proof surface see Remarks.

可耐温度范围及防滑表面见备注.

Note: Please attach copies of all contracts, receipts and other relevant documents.

备注: 请附上有关合约, 收据及其他有关文件副本.

Remark: Magnetometric sucking disc or working plateform is required for special work.

备注: 特殊工作另配磁力吸盘或工作平台.

Remarks: Please use separate sheet for large number of performers.

备注: 若人数众多,请另纸填写.

NOTE: Please click the picture for bigger size picture view.

备注: 请点击图像,以游览更大的图像.

Remarks: All successful registrants will receive a confirmation letter.

备注: 成功报名人士将获发确认信通知.

The processing characteristics and some material properties of silicon wafers depend on the orientation.

硅片的工艺性质与某些材料特性均与晶向有关.

Laser making of wafers for identification purpose will also become a new attribute.

为了定位,片子上的激光标记也将成为新的标志.

No food that I could dream of seemed half so utterly delicious as vanilla wafers.

我所梦想的任何食物都不如香草薄饼那么可口有味.

Personnel must wear proper clothing to protect the wafers.

工作人员必须穿适当的服装以保护硅片.

Food Quality-In the beginning, you can only feed your fish wafers.

鱼食质量升级:游戏开始, 你只能够给鱼喂食薄饼碎屑.

All right . We'll have some cheese wafers and caviar.

我们点一些干酪薄脆饼和鱼子酱.

Bonding Interface-The area where the bonding of two wafers occurs.

绑定面 - 两个晶圆片结合的接触区.

The resulting wafer is divided into individual pieces , called chips, and served to customers.

生产出来的晶片被分开成为许多单独的称为芯片的薄片, 为消费者服务.

WAT ( Wafer Acceptance Test ) is a very important stage of process.

WAT ( waferacceptancetest ) 是芯片制造过程中重要的测量站点.

A workflow model of a real time system used in wafer fabrication is developed.

结合目前国内半导体厂实时性差的特点,介绍了一晶圆制造过程实时系统工作流程.