bga的例句大全

It avoids PCB crooked or BGA blister from traditional technology of centralizing heating.

优化直向加热的传统技术,防止局部超高温而使线路板跷曲或BGA起泡 等不良影响,有效保护拆焊组件及线路板.

Assembly of Advanced packages such as Ball Grid Array ( BGA ) and Chip Size Package ( CSP ).

先进封装的装配,如球形焊点阵列和芯片尺寸封装.

This technique has been successfully applied in the dimensional measurement of BGA chip leads.

此技术已成功应用于BGA芯片管脚的三维尺寸测量中.

In large scale integrated chip field, the IC of BGA encapsulation was widely used.

在大规模集成芯片中以BGA( 球栅阵列)封装的IC芯片被广泛使用.

Unique a 3 segments'temperature curve program achieves a stage heating with good protection of BGA.

独设三段式温度曲线程序,实践分段升温控制,令BGA得到妥贴的保护.

Desirable for high-performance Ball Grid Array ( BGA ) package .

高性能球形焊点阵列封装需要 倒装焊.

BGA rework process is analyzed by PBGA and CBGA practical rework process to rapid BGA rework quality.

以PBGA和CBGA为例，结合实际返修过程中的经验，对返修过程中应注意的问题进行分析，以提高BGA的返修质量。

This phenomenon indicates that the strength of the IMC layers which connect the BGA and bonding pad is increased by adding nanoparticles.

这说明了钎料与焊盘连接处的IMC的强度在添加纳米颗粒后得到了明显的提高。