semiconductor的例句大全

IIT began as a fabless vendor of semiconductor products for the math coprocessor and graphics chipset markets.

印度理工大学的一开始是无晶圆厂的半导体产品供应商的数学协处理器和图形芯片组市场。

Light-emitted diode ( LED ) : A semiconductor diode which emits light when a voltage short form : LED.

发光二极管: 感受电压而发射光线的半导体二极管.

Discrete semiconductor devices and integrated circuits-Part 5-2 : optoelectronic devices-Essential ratings and characteristics.

分立半导体器件和集成电路.第 5-2 部分: 光电器件. 基本额定值和特性.

Study of Theory and Simulation on Semiconductor InGaAsP Quantum Wells Intermixing Technique

InGaAsP量子阱混合技术理论及模拟研究

The rates of photodecomposition of two organophosphorous compounds over various semiconductor catalysts were determinated, and the rates were depended on the kinds and surface properties of photocatalysts.

测量了两种有机磷化合物在各种半导体催化剂上的分解速率，反应速率与催化剂的种类和表面性质有关；

This paper introduces a digital temperature sensor LM75 with two-wire interface supplied by National Semiconductor Corporation.

介绍一种由美国国家半导体公司生产的设双线接口的数字温度传感器LM75。

LMX2332is digital PLL of the National Semiconductor Corporation in USA.

LMX2332是美国国家半导体公司生产的集成数字锁相环（PLL）电路。

Analysis and Summary on the New Power Products from National Semiconductor

新型National系列半导体电源芯片分析综述

Part 3 is the introduction of National Semiconductor and IC industry.

第三部分是对企业及行业背景的介绍及分析。

Organic semiconductors are organic functional materials with semiconductor characteristics. They are mainly organic small molecules and polymers with π-conjugated structure.

有机半导体是具有半导体特性的有机功能材料，主要是一类包含π共轭结构的有机小分子和聚合物。

The experimental data showed that organic semiconductor polymers with big π bond conjugate system are a new type of electrosensitive particle materials which are worth well developing.

实验结果表明，含有大π共轭体系的有机半导体高聚物是一种新型的具有开发价值的电敏粒子材料。

Study of Heat Transfer about Heat Pipe Type Cooler of Semiconductor Refrigerating Element

半导体制冷的热管式散热器传热研究

In this thesis, it studied the semiconductor laser pulse ranging system receiver circuit in depth.

本论文深入研究了半导体激光脉冲测距接收系统电路。

Families and products of bipolar memory for semiconductor integrated circuits

GB/T3438-1982半导体集成电路双极型存储器系列和品种

Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

As a semiconductor material whose reserves is largest in the lithosphere, Silicon is widely used in microelectronics and other fields for excellent properties.

作为地壳中储量最大的半导体材料，硅材料具有良好的半导体特性，广泛应用于电子信息等领域。

Study on the Surface Structure of the Semiconductor During Picosecond Laser Irradiation

皮秒激光辐照下半导体表面结构变化的研究

Data requirements for semiconductor die. Exchange data formats and data dictionary. Data exchange.

半导体压模的数据要求. 交换数据格式和数据字典. 数据交换.

The industrial experiences include computer peripheral , semiconductor, retail and fashion design.

这一些经验包含:电脑周边 、 半导体 、 零售业和流行业.

Elements are manufactured of green silicon carbide that is classed as an excess electron type semiconductor.

这种硅碳棒由一种新型的碳化硅制成,被归类为超级半导体.