tsv的例句大全

TSV ( Through Silicon Via) is a new interconnected technology that used in high density 3-dimensional packaging.

硅通孔（Through Silicon Via，TSV）技术是一种应用于高密度三维封装中的新兴互连技术。

Among them, TSV is a very key process.

TSV的形成是其中很关键的一个工序。

Considered factors of the cost, precision control and so on, dry process is generally used to fabricate TSV.

考虑到成本，精度控制等因素，一般倾向于使用干法刻蚀来制作TSV。

TSV technology mostly used the ICP-RIE process, and using MEMS technics in future main packaging would speed up MEMS industry.

TSV技术主要采用ICP-RIE工艺，将MEMS技术应用于未来的主流封装技术将会进一步加快MEMS产业的速度。