封装的例句大全

Packaging is now receiving more attention by both packaged-device vendors and system builders.

现在封装越来越受到成品器件的销售人员以及系统的施工人员两方面的更多注意.

Encapsulation has a similar effect on a collection of operations and properties.

封装起了类似的作用,把所需的操作和属性集合起来.

The microcapsules are suspended in a substance similar to vegetable cooking oil.

微型封装块悬浮在像食用油那样的物质中.

It may be desirable to encapsulate larger sequences of commands.

存在着封装更大规模的命令序列的需求.

A class encapsulates the properties and behaviors of an object.

类封装了对象的属性和行为.

Two package methods of Fiber Bragg Grating ( FBG ) temperature sensors were introduced.

介绍了光纤光栅 ( FBG,FiberBraggGratings ) 温度传感器的两种封装形式.

A delegate instance may encapsulate either static or instance method.

委托实例可以封装静态或实例方法.

Feb import dual-use monitoring system is linear and IC packaging.

电测系统选用进口双列封装的线性和集成电路.

But serial communications package better, also simple to use.

不过串口通讯类封装的较完善, 使用也简单.

This sort of ultra-fine wires can be used as bonding wires.

该超细丝材可用作集成电路封装键合丝.

The AC outlet is housed in robust aluminum housing.

该交流电插座封装在坚固的铝制外壳内.

Automatic Packaging pyramid time the four planes, each 160 W, high efficiency.

全自动封装层压机一次出四块, 每块160W, 效率高.

There are four translators in each package so a number of lines may be interfaced.

在每个封装壳中装有4个变换器,从而可以同许多线接口.

You will receive the letter in under a different cover.

你会收到那封装在不同信封里的信件.

Fixed error in file wrapper causing bad file copies.

修正在档案封装造成的坏档复制.

The article discusses the calculation of mechanical properties of welded metal-bellows applied in mechanical seal devices.

本文主要讨论应用于机械密封装置中的焊接金属波纹管力学性能的计算.

The accelerated test of a set of devices provides the time of vacuum maintenance.

对一批真空封装的器件进行了加速实验，得出了真空度保持的时间。

It features adopting new type pneumatic sealing device, special-shaped impellers and pre-segregation system.

其特点是引入了新型气动密封装置 、 异形叶片与预分散系统.

C-UV 9911 is used for encapsulation of IC chips as glob top with excellent temperature cycling performance.

C-UV9911可用于IC芯片的球形封装并具有极佳的温度循环性能.

Parasitic effects of packaging have significant effect on performance of RF ICs.

封装寄生效应对高频器件性能的影响越来越明显.