封装的例句大全

TSV ( Through Silicon Via) is a new interconnected technology that used in high density 3-dimensional packaging.

硅通孔（Through Silicon Via，TSV）技术是一种应用于高密度三维封装中的新兴互连技术。

TSV technology mostly used the ICP-RIE process, and using MEMS technics in future main packaging would speed up MEMS industry.

TSV技术主要采用ICP-RIE工艺，将MEMS技术应用于未来的主流封装技术将会进一步加快MEMS产业的速度。

Finite element analysis on soldered joint reliability of QFN device

QFN封装焊点可靠性的有限元分析

For assembly and test factories, OEE ( Overall Equipment Effectiveness) is a key index to measure production management and financial cost.

对于封装测试工厂，设备综合效率是衡量生产管理水平和成本竞争力的重要指标。

He had brought an envelope full of Victory Coffee and some saccharine tablets.

他带来个信封,装了胜利牌咖啡,还有几片糖精片.

The diodes can be small-signal types and should be in a light-tight enclosure.

这种二极管可以用小信号型的二极管,并且应当具有闭光的封装.

The Submersible Pump and Motor have a double seal with a moisture detection system.

配置潮气监测系统的潜水泵和电机具有双重密封装置.

Applicable to petrochemical container, seal airtight installation such as pump, valve, etc.

适用于石油,化工容器, 机泵, 阀门密封装置.

Melting seal packaging, a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观察吸附剂的状态。

With the object-oriented technology, an object is a single entity in which data and methods are capsulized. It can be used to represent knowledge or entities in simulated domain.

在面向对象技术中，对象能在单个实体中封装数据和操作（方法），并为知识和被模拟领域中的实体的表示提供条件。

In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip and substrate by experiment and3D mold flow simulation.

文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。

The FHG& FHK series offers high load carrying capabilities in a metric package.

在FHG&FHK系列具有高承载在度量封装能力。

This new material provides a main channel to solve the heat matching of electronic device package.

它的出现为解决电子元器件的封装热匹配问题提供了一条有效途径.

Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler

基于微通道致冷的大功率LED阵列封装热分析

Ultrasonic wire bonding is one of the most important technologies in chip interconnection of integrated circuits.

超声键合是实现集成电路封装中芯片互连的关键技术之一.

Wire bonding is still the most popular interconnect technology in the first-level packaging.

一级封装中最流行的互连技术仍为丝焊.

When packaging the circuit, pay special attention to the pc board's layout.

封装电路时, 需要特别注意电路板的布局.

Study on a New Al-1% Si Bonding Wire for Encapsulation of Integrate Circuit

集成电路封装用新型Al-1%Si键合线的研制

The Development and Heat Dispersion Problem in Integrate Circuit Packaging

集成电路封装高密度化与散热问题

Multi-Agent Based Legacy System Encapsulation in Agile Supply Chain

敏捷供应链中基于多代理的Legacy系统封装技术