封装的例句大全

The Submersible Pump and Motor have a double seal with a moisture detection system.

配置潮气监测系统的潜水泵和电机具有双重密封装置.

The diodes can be small-signal types and should be in a light-tight enclosure.

这种二极管可以用小信号型的二极管,并且应当具有闭光的封装.

He had brought an envelope full of Victory Coffee and some saccharine tablets.

他带来个信封,装了胜利牌咖啡,还有几片糖精片.

For assembly and test factories, OEE ( Overall Equipment Effectiveness) is a key index to measure production management and financial cost.

对于封装测试工厂，设备综合效率是衡量生产管理水平和成本竞争力的重要指标。

Finite element analysis on soldered joint reliability of QFN device

QFN封装焊点可靠性的有限元分析

Substitution of the aromatic hydrogen atom of the Schiff base ligand with electron withdrawing group decreased the amount of the complex encapsulated in the zeolite cavities, but could improve the catalytic activity of the encapsulated complex.

席夫碱芳环上的H被吸电子基团取代后，降低了Y分子筛超笼中封装的钴配合物的量，但能改善催化活性。

However, the package format is only so few codes.

不过格式的封装只有那么几种编码.

The influenceof insulation thickness to CTR and BV, of package dimension to BV is discussed.

同时研究了电流传输比(CTR)和绝缘电压(BV)随绝缘距离的影响关系, 以及BV与封装尺寸的影响关系.

The stem and packing gland are also stainless steel for corrosion protection.

阀杆和填料密封装置同样采用不锈钢,具有耐腐蚀性能.

Research on an Encapsulation Method for the DAI in Grid Application

数据访问与集成的网格化封装方法研究

Solid state encapsulation technique of small volume high voltage power supply

小体积高压电源的固体封装技术

Research on encapsulation of service component based on service-oriented architecture

基于SOA的服务构件封装技术研究

Design of transfer mould and encapsulation technique for integrated circuit package

电子集成块封装工艺及传递模设计

Design and implement of motion control in auto encapsulation system

自动封装系统中运动控制的设计与实现

According to the practical application, simplify the standard RTP/ RTCP protocol. Under the premise of no more than the network MTU size, design different encapsulations.

根据实际运用对标准RTP/RTCP协议进行简化，在不超过网络MTU的前提下，对音视频数据设计了独自的RTP封装方式。

In this project, we use COM technology to seal and call the Database Model Layer.

本课题中以COM组件的形式封装和调用了数据库模型层组件.

A new seal device for floating roof storage tank

浮顶储罐的一种新型密封装置

Wire loop profile and its strain, which greatly affect the density and stability of IC packaging, are determined by the capillary trajectory.

IC引线键合中，键合头的运动轨迹决定着引线轮廓的形状和内部张力，影响着封装的密集度和稳定性。

This paper discusses a true wafer level packaging ( WLP ) technology which is called Ultra CSPTM.

文章论述了超CSPTM圆片级封装技术工艺.

Implement IPQC and OQC on the assembly and test vendor.

按公司产品要求抽检封装及测试厂生产及发货质量.