封装的例句大全

Templates that encapsulate properties that are type lists model an MPL-compatible type sequence.

封装了类型列表属性的模板则依照MPL兼容的类型序列.

Can get the main motherboard, CPU, card and other hardware information.

主要可以获取主板, CPU, 显卡等硬件信息.并封装成类便于调用和二次开发.

The Trend of IDM Outsource and Opportunities for China Semiconductor Packaging & Testing Companies .

传统的 IDM 外包趋势与中国半导体封装产业的机遇?

Polymorphism is the capability of something to assume different forms.

封装,是事物(对象)呈现不同形态的能力.

The author introduced the properties of photosensitive packaging adhesive.

介绍了一种光敏封装胶的制备方法、性能及应用情况.

It can also bond and package many kinds of photoconductive fiber communication apparatus.

可用于光纤通讯器件的粘接封装.

Packaging a category, and detailed test code.

封装了一个类, 且有详细的测试代码.

Package in 8 mm tape on 7 diameter reels.

封装在8毫米磁带7直径卷筒.

The milk was sterilized and sealed in bottles.

牛奶经过灭菌处理后被封装在瓶子里。

Heat-sink and Package datum , Pad Spacing, Gap , Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据,衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的,未电镀引线.

The stable 1.3μ m InGaAsP travelling-wave semiconductor optical Amplifier ( TW-SOA ) module is demonstrated in this paper.

报道一种具有稳定封装结构的1.3μmInGaAsP行波半导体光放大器.

The fixed conventional wellhead sealing units which are often used today have no displacement adjustment function.

目前,使用较多的固定式常规型井口密封装置不具备调偏功能.

Station 1-TR: Check top view marking.

站台1-封装: 检测顶视印记的质量.

The coefficient of thermal expansion ( CTE ) is very important for studies of composite and thermo-mechanical analysis.

本文采用激光散斑干涉法测量微电子金属封装用金属复合 引线 的热膨胀系数.

Study on Packaging Techology of Ultraviolet LED with High Efficiency and Reliability

高效率、高可靠性紫外LED封装技术研究

The location even more special this year as IMAPS started here 40 years ago!

今年的研讨会地址也是国际微电子与封装协会40年来尤其特殊的一次.

You could certainly model it the same way with Google's data store, but it would be more efficient to encapsulate the phone number as part of the user ( as a list or an array of phone numbers).

您完全可以按同样的方法用Google的数据存储建模，但将电话号码封装为用户的一部分（作为一个电话号码的列表或数组），效率会更高。

Tag and steel are built in one, sealed into environmental friendly rosin, water-proof and anti-collision .

将电子标签与金属钢材一体成型, 并封装于环保树脂矽胶内, 防水、 防撞.

Microelectronic Package Technology of Striding Forward New Millenary

迈向新世纪的微电子封装技术

Based on the Intel X79 Express chipset, the board supports upcoming Sandy Bridge-E enthusiast processors in the LGA2011 package.

基于英特尔X79高速芯片组的主板支持即将在距桥的LGA2011封装-E的爱好者处理器。