电镀的例句大全

Electrolysis is also used to plate one metal on another.

电解也用于将一种金属电镀在另一种金属上.

Processes which can lead to cathodic protection, phosphating, pickling, and electroplating.

阴极保护, 磷化反应, 酸洗和电镀都会造成氢脆变.

Of the total industrial cadmium use, 90 % is utilized in electroplating and pigments.

工业用镉总量的90%用于电镀和涂料.

In electroplated metals, these defects are primarily dislocations, twins, and deposited foreign atoms or molecular groups.

对于电镀的金属来说, 这些缺陷主要是位错, 孪晶和其沉积的异类,原子或分子基因.

The process of anodizing lnvolves the deposition of further oxide on the surface.

阳极电镀的工序就是在表面进一步附着氧化层.

We prefer brass because of its excellent casting, polishing and electro-plating properties.

我们宁愿黄铜由于其出色的铸造, 抛光和电镀性能.

A new process of non cyanide gold imitation plating was advanced.

提出了一种无氰仿金电镀新工艺.

A lot of sulfonated bodies applied in electroplating field were particularized.

列举了在电镀领域中实际应用到的各类磺化产物.

The effect of additives on zinc-nickel alloy electroplating was studied.

研究了添加剂在电镀锌 镍合金 中的作用.

Between electroplated layer and substrate level of electroplated sample is obviously stratified.

而电镀层与基体层之间有明显的分层现象.

The buildup of impurities often results in defective plating.

杂质的积累经常导致不良的电镀.

In printing, a duplicate letterpress plate made from an original by electroplating.

在印刷技术中, 一种用电镀方法从原版复制成的印刷版.

To plate metal is to cover it with a thin layer of gold, or silver, etc.

电镀金属就是把金属薄薄地覆盖上一层金或银等.

Galvanization means coating metal with zinc, or the act of stimulating action.

电镀是指给金属覆上一层锌, 或是一种刺激反应的作用.

The surface can be treated with galvanization.

表面可电镀。

Are plating adhesion tests performed per IPC-6012 , Class 2 Section 3.3.7?

根据IPC-6012, 2级标号尊3.3.7执行电镀附着性测试?

An electroplated impression of a phonograph record used to make duplicate records.

唱片模版用于复制唱片的电镀留声机唱片.

Is the IPC tape test performed on each lot for plating adhesion?

针对每批电镀附着力,是否使用IPC胶带测试?

Pilot line chemicals stock take & inventory control.

电镀药水盘点 和 库存控制.

Used in the masking operation during wave solder process on PCB, prevented liquid immersing and polluting.

用于PCB板含浸过程中遮蔽金手指部分和防止电镀液浸入及污染.