In this paper, we study the effect of As 5+, Sb 3+, Bi 3+ on kinetics of cathodic deposition of copper in acidified CuSO 4 system at quasi steady state condition by linear potential sweep method.

  • 用线性电位扫描法研究了在准稳态条件下,As5+、Sb3+、Bi3+离子对酸性硫酸铜体系中阴极铜沉积反应动力学的影响。

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