There are two pairs of competitive factors in the F doped porous low k silicamaterials: porous and mechanical strength, porous and electrical property.

  • 在低k的多孔掺F氧化硅材料当中,存在着两对竞争因素:多孔与机械强度,多孔与电学性质。

  • 互联网摘选 2025-02-21 15:31:46

    • 相关例句
    精确
    • 模糊
    • 词首
    • 词尾
    • 词义
    • 例句