This paper presents techniques and methods used in fault management of inter domain routing.

Unbalanced regional economic growth and inter regional economic disparities in China

区域经济的非均衡增长与差异

Development of Inter-car Damper Applied to High-speed Train

高速列车车端减振装置的研制

Inspiration from the Evolution of the Inter-national Gas Market

国外天然气市场发展给我们的启示

Prediction and Analysis on Electric Price of Grid Inter region

互联电网地区电价的预测与分析

A Structure-Conduct-Performance Analysis of Inter-bank Bond Market

银行间债券市场的SCP分析

Perfecting the inter government structure, building the present company system;

完善内部治理结构，构建现代公司制；

A practical approach for inter-regional bilateral contracts congestion management

区域电力市场双边交易阻塞管理实用计算方法

On Strengthening the Management of Tuition and Miscellaneous Fees in Colleges and Universities

浅谈高校学生收费工作的管理关于强化高校学生收费管理的思考

Initial fee is not charged Do not collect training fees, do not charge annual management fee is not charged other miscellaneous fees.

不收取加盟费，不收取培训费，不收管理年费，不收取其它杂费用。

Based on a survey of360 kindergartens nearly half of those in the SAR the council found that parents of kindergarten children paid an average of$ 2, 930 in miscellaneous fees a year.

消委会调查了全港近一半（360间）幼儿园，发现幼儿园平均每年向每个学生收取2930元杂费。

With the development of PIC ( Power Integrate Circuit), we request more for the performance of Power Devices.

随着现代功率集成电路的发展，对功率器件的性能提出了更高要求。

Mixed-Signal integrate Circuit technology

混合信号集成电路技术

The copper alloy strip of lead frame is the fundamental material for integrate circuit.

引线框架用铜带是集成电路的重要基础材料。

The motion controller went through discrete electric component, integrate circuit and software control development processes.

运动控制器历经了分立电子元件、集成电路到软件控制发展阶段。

Study on the Development of Integrate Circuit ( IC) Industry in China Based on Value Chain Analysis

基于价值链的中国集成电路产业发展对策

Low Temperature Application Research of the Focal Plane Array Read-out Integrate Circuit

焦平面读出电路设计中的低温应用研究

With the development of "scaling" in Integrate Circuit, the critical dimension reduces continuously.

随着集成电路按比例缩小趋势的不断发展，刻线临界尺寸不断减小。

The Development and Heat Dispersion Problem in Integrate Circuit Packaging

集成电路封装高密度化与散热问题

Parameter Extracting of Interconnection Line and Via in High-speed Integrate Circuit

高速集成电路中互连线与Via结构的参数提取

Study on Fixed-abrasive Chemical-mechanical Polishing Technology of Wafer in Integrate Circuit Manufacturing

集成电路制造中的固结磨料化学机械抛光技术研究