Delamination caused by electrical-over-stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.

  • 由过电应力 ( EOS ) 和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式.

  • 互联网摘选 2025-01-18 13:16:55

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