reflow

Suit for reflow and wave flow solder.

适应再流焊与波峰焊.

Good management for reflow and wave profile and profile board.

良好的管理为回流焊和波峰焊温度曲线及温度曲线量测板.

The reflow process relies on the temperature profile setting.

回流过程依赖于温度曲线的设定.

After reflow, carefully remove substrate with components and allow to cool.

回流后, 仔细拿开带组件的基板,并使之冷却.

Hand solder is recommended instead of reflow solder.

不建议使用回流焊,推荐使用手动焊接.

Clear how to measuring reflow and wave profile.

清楚怎样测量回流焊和波峰焊温度曲线.

Adapted to the reflow soldering.

适应于回流焊接.

Delamination caused by electrical-over-stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.

由过电应力 ( EOS ) 和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式.

The most obvious is the necessity for increased reflow temperature.

最明显的是,使用无铅锡膏必须提高回流焊温度.

A potential reflow method-laser reflow soldering was expatiated in detail.

着重阐述了一种极具潜力的再流焊方法 ——— 激光再流焊.

Suitable for flow and reflow soldering.

适合一般焊接及回焊.

Do not inhale the vapor during reflow.

不要吸入回流焊时喷出的蒸气.

Compatible with infrared and vapor phase reflow solder process.

适用于回流焊接工艺.

Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏.

Suitable for SMT craft reflow soldering.

适用于回流焊SMT工艺.