The silicified wood is told in terms of wood although the shape exists, and die actually.

Mineralization relates closely to the silicified rock.

金矿化与早期灰白色硅化岩密切相关.

A kind of silicified fossil wood with mixed pits on the radial tracheid wall is described.

报道了一种具混合型纹孔(互列式纹孔和对列式纹孔)的化石木.

A high throughput in silico data analysis system for cDNA library, CLASP, was constructed by bioinformatic approaches.

应用生物信息学方法, 构建了一套针对cDNA或 EST文库 的高通量、自动化分析体系, CLASP(cDNALibraryAnalysisSystemPrimary).

The circumstances of making high-grade ferrotungsten by alumino-silico-thermic process are described.

本文介绍了铝硅热法生产高钨铁的工艺研究情况,讨论了一些工艺条件对冶炼的影响.

Organic Silico-modified acrylic resin leather finishing agent is use the emulsion of organic silico-modified acrylic resin.

有机硅 改性丙烯酸 树脂皮革涂饰剂是采用有机硅改性的丙烯酸树脂乳液.

And Silicon Image also pays attention to respect employees as the culture of the company.

同时,公司也注重企业文化的培养,尊重人才善用人才.

The Earth is made mainly of iron and silicon and things like that.

地球主要由铁、硅等物质构成。

...a thin layer of silicon oxide...

一层薄薄的氧化硅

The silicon chip is of the most significant inventions of the past 50 years.

硅制电脑芯片是过去50年中最重要的发明之一.

This generation is characterized by more and more transistors being contained on a silicon chip.

这一代计算机的特征是一个芯片上包含越来越多的晶体管.

One way is to interface it to a silicon chip.

方法之一就是把微生物放到一个硅芯片中.

This paper describes a set of techniques for extracting the patterns from silicon chip images.

本文介绍了一种集成电路芯片图像矢量化技术.

Extracting layouts from silicon chip images using image processing techniques can increase working efficiency greatly.

使用图像处理技术提取集成电路版图数据则可大大提高效率.

Large fires may produce heavy clouds of silicon dioxide.

大火会产生二氧化硅的浓烟.

Bonded Wafers-Two silicon wafers that have been bonded together by silicon dioxide, an insulating layer.

绑定晶圆片 - 两个晶圆片通过二氧化硅层结合到一起, 作为绝缘层.

There is a protective coating of silicon dioxide on the silicon carbide.

在棒的表面有一层二氧化硅保护涂层.

The method is to coat a wafer of silicon with a protective layer of silicon dioxide.

其方法是往硅片上涂上一层二氧化硅防护膜.

A physical model of dielectric breakdown was presented in IC silicon dioxide films.

提出了芯片门电路硅氧化层静电放电介质击穿的物理模型.

Other Ingredients: Gelatin, Water, Calcium Carbonate, Silicon Dioxide, Magnesium Stearate, Maltodextrin and Sodium Louryl Sulfate.

其他材料: 明胶, 水, 碳酸钙, 二氧化硅, 硬脂酸镁, 麦芽糊精和硫酸月桂酸钠.

Organosilicon deformer is obtained from dimethyl-silicon oil and silicon dioxide through teat of orthogonal design.

采用正交设计实验法以二甲基硅油及二氧化硅为主要原料制备了有机硅消泡剂.