Structure characteristics and evolution at wedge bonding interface

Evolution of the Bond Interface During Ultrasonic Wedge Bonding Process

超声楔键合过程界面接合部演化规律研究

Effect of bonding time on thick aluminum wire wedge bonding strength

键合时间对粗铝丝超声引线键合强度的影响

Install the toilet flush line, the sink drain, the potable water lines, the bonding jumper, and the control cable.

安装马桶冲水管，洗手池排放，饮用水管，搭地线及控制钢索。

In order to meet the industrialized requirement, the explosive bonding for large and thick stainless steel with billet was experimentally investigated.

为了满足爆炸复合-轧制一体化技术的产业化要求，该文成功地进行了不锈钢/普碳钢大型厚板坯（复板厚20mm）的爆炸复合试验。

The data obtained from experiment will be useful to industrialization of explosive bonding for large and thick stainless steel with billet.

试验所得到的数据为不锈钢/普碳钢大型厚板坯的爆炸复合产业化提供了依据。

Explosive bonding parameters obtained from calculation show a proper window for explosive welding of stainless steel and regular steel billets.

爆炸焊接参数通过计算和优化设计，准确地预示了不锈钢/普碳钢大型厚板坯的爆炸焊接窗口；

Explosive bonding for large thick stainless stell and billet

大型不锈钢/普碳钢厚板坯的爆炸焊接

TEM study of bonding layers in dissimilar alloy explosive bonding joints

异种金属爆炸焊结合层的电子显微镜研究

Analysis of Movement and Qualities of Explosive Bonding Plate

爆炸复合板运动及特性分析

The explosive bonding parameters were calculated and optimized before experiment.

试验前，首先对爆炸复合参数进行了计算和优化设计。

Application of Phosphate Bonding Agent to Art Casting in Ceramic Mold

磷酸盐粘结剂用于陶瓷型艺术铸造

Molecular Design of the Bonding Agent for Double Base Propellant

双基推进剂硝胺脱湿及其键合剂分子设计

Development of Bonding Agent for Silk Pigment Printing and Printing Technology

真丝绸涂料印花粘合剂的研制及印花工艺

As the bonding agent of electrode used in aluminum industry.

做铝行业的阳极粘结剂。

The hardness distributing near bonding pad and strength of interface have been studied. The interface structure and bonding mechanism of electromagnetic hemicontinuous double pouring casting roll have been analyzed.

研究了结合界面附近的硬度分布和界面的结合强度，并分析了电磁半连续复合铸造轧辊的界面结构和结合机理。

This phenomenon indicates that the strength of the IMC layers which connect the BGA and bonding pad is increased by adding nanoparticles.

这说明了钎料与焊盘连接处的IMC的强度在添加纳米颗粒后得到了明显的提高。

This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital Image Processing and Pattern Recognition.

介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。

In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.

文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。

Layer thickness analysis results from a bonding pad on a circuit board, showing nanometer resolution thickness analysis.

来自电路板结合区的厚度分析，纳米尺度的厚度分析。

The influence of junction area and bonding pad size on the dark current has been also analyzed.

文中还对器件结面积和电极尺寸等对暗电流的影响进行了比较和分析。