Design of welding pressure control system for ultrasonic gold wire bonding machine

Development of Control System Used in Ultrasonic Al Wire Bonding Machine

超声波铝线自动邦定机控制系统的研制

In order to enhance the welding speed of microcircuit chips, the control software algorithm for the bonding machine was optimized.

为了提高生产微电路芯片的焊接速度，我们对超声波焊接机工业控制软件的算法进行部分优化。

The control software for ultrasonic bonding machine is indispensable for the automatic production-lines run by manufactories making microcircuit chips.

超声波焊接机控制软件是国内外生产微电路芯片厂家自动化流水线的不可缺少的一部分。

Research on Bonding Layer of Transfer Foil Operation

转印箔中粘接层的研究

Impact of the chip bonding layer material on the thermal resistance of power LED

芯片键合层材料对功率型LED热阻的影响

Two dimensional finite element analysis of ceramic veneer bonding layer

对瓷贴面粘结层的有限元应力分析

The Distributed Force Model of Intelligent Beam Structures Based on Effect of Bonding Layer

考虑粘贴层影响的智能结构梁分布力模型

The capability variation rule of bonding layer was also analysed.

采用滑动磨损法检测了耐磨性，并分析了衬瓷层性能的变化规律。

Technique, such as electronic probe, XRD, optical microscope, micro-hardness and macro hardness test, are applied to investigate the microstructure, phase structure, and analyze the alloy element distribution of metallurgical bonding layer and the material mechanical property changes.

利用电子探针、XRD、光学显微镜、显微硬度和宏观硬度测试等手段，研究扩散件试样的显微组织、物相结构，分析冶金结合层中合金元素分布和材料内部力学性能变化。

TEM study of bonding layer in Cu-Al explosively welded joint

Cu－Al爆炸焊结合层的透射电镜研究

Study on the Preparation and Ball Bonding Process for the High-Performance Copper Bonding Wire

高性能键合铜丝的制备及其球键合工艺研究

Contrast Research on the Reliability of Gold and Copper Wire/ Ball Bonding

金、铜丝球键合焊点的可靠性对比研究

Fracture Analysis of Ball Bonding Gold Wire and the Way to Improve Processing Function

球焊金丝产生断裂的原因及改善加工性能的途径

Study on the Technology of High Density Gold wire Ball Bonding under Normal Temperature

高密度常温金丝球焊接技术探讨

Development of these work is of benefit to raising quality of gold wire ball bonding.

这些工作的开展有利于提高金丝球焊的焊接质量。

Discussion of quality control of gold wire ball bonding

金丝球焊质量控制的探讨

The topic of political responsibility in administrative decision-making is an important bonding point of administration and political science. Thus the research on it has significant theoretical and pragmatic meaning.

行政决策中的政治责任课题是行政学领域与政治学领域的重要结合点，因此对此课题的研究具有重要的理论和现实意义。

Yunnan minority nationalities believe that the house spirit articles are a bonding point between the primitive religion and reality and the medium between god and man.

民居灵物作为原始宗教与现实生活的结合点、神人沟通交流之中介，在云南少数民族中广泛存在；

On the view of this article, there is a bonding point between the current accounting and the virtual value activities in the value chain accounting ( VCA).

认为价值链的整合使价值链会计在现行会计核算体系与虚拟价值链活动之间存在一个切合点；

There was complicated change in the EST bands and stable in the MDH because the bonding point of the pesticides were different.

由于不同种农药的作用结合位点不同，使得酶带变化规律也不相同，当虾体被注射农药后，EST酶带变化较复杂，而MDH酶带则较稳定。