Boron trichloride has been used in a new process for etching stannic oxide films ( non-isothermal plasma) which is capable of etching 1.5 micron lines with excellent resolution and high precision.

  • 本文采用三氯化硼作反应试剂,研究一种新的蚀刻二氧化锡薄膜工艺.此工艺可以蚀刻1.5μm的线条,其分辨率好且精度高。

  • 互联网摘选 2025-01-20 11:58:19

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