bonding的例句大全

Well, with covalent bonding, it's not so simple.

但对于共价键就没这么简单了。

He's famous for a lot of things, one of which is covalent bonding.

他有许多著名的发现，其中一个便是共价键。

The results show that intramolecular coordination ability bears a parallel relationship with stabilization energy, bond parameter and charge transfer. For these coordination compounds intramolecular interaction is mainly a σ-bonding and the coordination force is essentially covalent interaction.

结果表明，分予闻配位强弱与稳定化能、键参量、电荷转移成平行关系，分子间作用键主要是σ配键，揭示了配位力的本质是授受电子的共价作用。

Finally, the channel-structured glass substrate was sealed to a cover glass plate by using room temperature bonding technique.

最后，采用室温键合技术，将带有微纳结构的基片与盖片封合成玻璃微-纳流控复合芯片。

The manufacture process was improved from the first cold bonding-post curing to primary cure by using the mold having chevron cell, and the adhesion strength between the chevron type of pattern and the belt body was improved, and the conveyance capability was significantly increased.

制作工艺由起初的冷粘合二次硫化改进为在硫化机上加装人字花纹模具一次整体硫化，提高了花纹和带体间的粘合强度，明显地增加了输送带的输送量；

Bonding of Target Material and Backing Plate for 9900 Sputtering System

9900型靶材与靶托的连接技术

Are the hydrogen bonding patterns between the strands of the jelly roll fold equivalent for all pairs of strands? If not, where do they differ?

是否所有成对的股与股之间的瑞士卷摺叠对等体的氢键分布皆相同？如果不是，它们的差异为何？

Effect of concentration of silane coupling agent on bonding strength of barium glass to resin matrix

硅烷偶联剂的浓度对钡玻璃与树脂基质间粘接强度的影响

Study on Bonding Strength of Horizontal Bedding Joint against High Arch Dam's Bearing Capacity

水平层缝结合强度对高拱坝承载能力的研究

Effect of heat treatment on bonding of TAI/ LY12 rolled bimetal plate is studied.

研究了热处理制度对TAl/LY12轧制双金属板结合性能的影响。

Application advantage of CCAW ( copper clad aluminum wire) and processing technology of clad-process welding CCAW were introduced. The effect factor of solid-state bonding during drawing the bimetal wire was analyzed.

介绍了铜包铝线的使用优点和包复焊接铜包铝线加工工艺过程，分析了通过双金属拉拔实现金属间固相结合的影响因素；

An Investigation of Deformation Behavior and Bonding Strength of Bimetal Strip during Cold Rolling

双金属复合材料冷轧变形行为及结合强度的研究

Study of A Tearing Method Measuring Bonding Strength of Cold Rolling Cladding Bimetal Strip

一种测试冷轧双金属复合板撕裂结合强度方法的研究

The bonding performance can be modified by use of soil binder and enhanced soil compression strength was achieved.

利用土壤粘合剂对土壤进行粘结，以改善土壤的粘结性能，达到提高土壤压缩强度的效果；

The experimental results showed that the bonding performance of the soil binder was related to its gel SiO_2 content and structure of the noncrystalline phase.

结果表明：土壤粘合剂粘结性能与SiO2溶胶数量及结构性能有关。

The basic principle of Wafer bonder is to require bonding material applied a series of external conditions, such as pressure, temperature, environment, voltage.

晶圆键合机的基本原理是对需要键合的材料施加一系列的外部条件，比如压力、温度、环境、电压，不同的外部条件可以用来进行不同材料和结构的键合。

Wafer bonder is divided into five subsystems: aeration system, vacuum system, high-voltage system, heating system, wafer transfer system. The five subsystems can provide the necessary external conditions for bonding.

晶圆键合机分为充气系统，真空系统，高压系统，加热系统，晶圆传送系统五个子系统，这五个子系统可为键合提供压力、环境、电压和温度等外部条件。

So, let's start our discussion of a bonding orbital.

让我们开始来讨论成键轨道。

And this again is what we're going to call a bonding orbital.

同样，我们叫它成键轨道。

And what you find is when you have a bonding orbital, the energy decreases compared to the atomic orbitals.

你们发现当你有个成键轨道的时候，相比原子轨道能量要降低。