Wafer bonder is divided into five subsystems: aeration system, vacuum system, high-voltage system, heating system, wafer transfer system. The five subsystems can provide the necessary external conditions for bonding.

  • 晶圆键合机分为充气系统,真空系统,高压系统,加热系统,晶圆传送系统五个子系统,这五个子系统可为键合提供压力、环境、电压和温度等外部条件。

  • 互联网摘选 2025-01-20 11:57:52

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