The simulation results show that the temperature field of the ceramic packaged sensor is similar to that of unpackaged one, which proves the feasibility of this packaging scheme.

  • 模拟结果显示,该封装后的传感器的温度场与未封装传感器相似,证明陶瓷封装结构是可行的;

  • 互联网摘选 2025-01-20 18:56:29

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