Nowadays, in the manufacturing of microelectronic components fluorocarbon plasma was widely used in low K a-C: F: H film deposition and the etching of SiO_2, Si and other related materials.

  • 目前,碳氟等离子体被广泛用在器件的微细加工过程中,如沉积低介电常数的氟化非晶碳薄膜,刻蚀SiO2、Si以及其它相关材料。

  • 互联网摘选 2025-02-21 15:31:46

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