Finally, the two activated surfaces are joined together in an EVG 501 wafer bonder by applying a modest and uniform contact force at low temperatures, ensuring hermetic sealing of the cavities and preventing destruction or distortion of small features.

  • 最终结果是,在EVG501晶圆键合机上,两个活化的表面在低温下通过施加一个适中的、均匀的接触压力而连接在一起,保证了空腔密封并防止了小结构的破坏和变形。

  • 互联网摘选 2025-01-20 11:57:52

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