A high strength insulating brick with high alumina and low iron oxide has been developed by using floating particles and bonding clay as starting material with expanding agents, flux and combustible additives.

All these fulfil the quality requirement of electroceramics and the rectorite clay is a new-type bonding clay of electroceramics.

研究结果表明累托石粘土是一种新型的优质电瓷结合粘土。

Analyse the application of visual system in COG bonding machine.

针对视觉系统在全自动COG热压焊机中的应用进行分析。

The automatic position alignment system for the ultrasonic wire bonding machine

超声压焊机自动位置对准系统

Design of control system for the tape automatic bonding machine Based on PLC

基于PLC的TAB绑定机控制系统设计

Design of welding pressure control system for ultrasonic gold wire bonding machine

超声波金丝球焊线机焊接压力控制系统设计

Development of Control System Used in Ultrasonic Al Wire Bonding Machine

超声波铝线自动邦定机控制系统的研制

In order to enhance the welding speed of microcircuit chips, the control software algorithm for the bonding machine was optimized.

为了提高生产微电路芯片的焊接速度，我们对超声波焊接机工业控制软件的算法进行部分优化。

The control software for ultrasonic bonding machine is indispensable for the automatic production-lines run by manufactories making microcircuit chips.

超声波焊接机控制软件是国内外生产微电路芯片厂家自动化流水线的不可缺少的一部分。

Research on Bonding Layer of Transfer Foil Operation

转印箔中粘接层的研究

Impact of the chip bonding layer material on the thermal resistance of power LED

芯片键合层材料对功率型LED热阻的影响

Two dimensional finite element analysis of ceramic veneer bonding layer

对瓷贴面粘结层的有限元应力分析

The Distributed Force Model of Intelligent Beam Structures Based on Effect of Bonding Layer

考虑粘贴层影响的智能结构梁分布力模型

The capability variation rule of bonding layer was also analysed.

采用滑动磨损法检测了耐磨性，并分析了衬瓷层性能的变化规律。

Technique, such as electronic probe, XRD, optical microscope, micro-hardness and macro hardness test, are applied to investigate the microstructure, phase structure, and analyze the alloy element distribution of metallurgical bonding layer and the material mechanical property changes.

利用电子探针、XRD、光学显微镜、显微硬度和宏观硬度测试等手段，研究扩散件试样的显微组织、物相结构，分析冶金结合层中合金元素分布和材料内部力学性能变化。

TEM study of bonding layer in Cu-Al explosively welded joint

Cu－Al爆炸焊结合层的透射电镜研究

Study on the Preparation and Ball Bonding Process for the High-Performance Copper Bonding Wire

高性能键合铜丝的制备及其球键合工艺研究

Contrast Research on the Reliability of Gold and Copper Wire/ Ball Bonding

金、铜丝球键合焊点的可靠性对比研究

Fracture Analysis of Ball Bonding Gold Wire and the Way to Improve Processing Function

球焊金丝产生断裂的原因及改善加工性能的途径

Study on the Technology of High Density Gold wire Ball Bonding under Normal Temperature

高密度常温金丝球焊接技术探讨

Development of these work is of benefit to raising quality of gold wire ball bonding.

这些工作的开展有利于提高金丝球焊的焊接质量。