bonding的例句大全

Structure characteristics and evolution at wedge bonding interface

Ni-Al超声楔焊键合分离界面的结构特性及演变规律

New Type Roller Contour of Bonding Pad Roll for SSAW Pipe Unit

新型螺旋焊管机组焊垫辊辊型

Are the hydrogen bonding patterns between the strands of the jelly roll fold equivalent for all pairs of strands? If not, where do they differ?

是否所有成对的股与股之间的瑞士卷摺叠对等体的氢键分布皆相同？如果不是，它们的差异为何？

Effect of concentration of silane coupling agent on bonding strength of barium glass to resin matrix

硅烷偶联剂的浓度对钡玻璃与树脂基质间粘接强度的影响

Study on Bonding Strength of Horizontal Bedding Joint against High Arch Dam's Bearing Capacity

水平层缝结合强度对高拱坝承载能力的研究

Effect of heat treatment on bonding of TAI/ LY12 rolled bimetal plate is studied.

研究了热处理制度对TAl/LY12轧制双金属板结合性能的影响。

Application advantage of CCAW ( copper clad aluminum wire) and processing technology of clad-process welding CCAW were introduced. The effect factor of solid-state bonding during drawing the bimetal wire was analyzed.

介绍了铜包铝线的使用优点和包复焊接铜包铝线加工工艺过程，分析了通过双金属拉拔实现金属间固相结合的影响因素；

An Investigation of Deformation Behavior and Bonding Strength of Bimetal Strip during Cold Rolling

双金属复合材料冷轧变形行为及结合强度的研究

Study of A Tearing Method Measuring Bonding Strength of Cold Rolling Cladding Bimetal Strip

一种测试冷轧双金属复合板撕裂结合强度方法的研究

The bonding performance can be modified by use of soil binder and enhanced soil compression strength was achieved.

利用土壤粘合剂对土壤进行粘结，以改善土壤的粘结性能，达到提高土壤压缩强度的效果；

The experimental results showed that the bonding performance of the soil binder was related to its gel SiO_2 content and structure of the noncrystalline phase.

结果表明：土壤粘合剂粘结性能与SiO2溶胶数量及结构性能有关。

The basic principle of Wafer bonder is to require bonding material applied a series of external conditions, such as pressure, temperature, environment, voltage.

晶圆键合机的基本原理是对需要键合的材料施加一系列的外部条件，比如压力、温度、环境、电压，不同的外部条件可以用来进行不同材料和结构的键合。

Wafer bonder is divided into five subsystems: aeration system, vacuum system, high-voltage system, heating system, wafer transfer system. The five subsystems can provide the necessary external conditions for bonding.

晶圆键合机分为充气系统，真空系统，高压系统，加热系统，晶圆传送系统五个子系统，这五个子系统可为键合提供压力、环境、电压和温度等外部条件。

So, let's start our discussion of a bonding orbital.

让我们开始来讨论成键轨道。

And this again is what we're going to call a bonding orbital.

同样，我们叫它成键轨道。

And what you find is when you have a bonding orbital, the energy decreases compared to the atomic orbitals.

你们发现当你有个成键轨道的时候，相比原子轨道能量要降低。

The Map Analysis of Bonding orbital Wave Function of Fe-Mo-S Cluster the Analogue of the Nitrogenase Fe-Mo-Cofactor

固氮酶Fe-Mo辅基模拟物Fe-Mo-S原子簇成键轨道的波函数图形分析

The valence bonding orbital rules in polyacids

多酸的价成键轨道规则

It turns out that the antibonding orbital is a little bit higher from the atomic orbital level than the bonding orbital is lower.

这证明了，反键轨道，比原子轨道高，成键轨道比原子轨道第。

The explosive bonding parameters were calculated and optimized before experiment.

试验前，首先对爆炸复合参数进行了计算和优化设计。