process的例句大全

The history of development, manufacturing process, structure, properties and application of the multiple boride base cermet are reviewed.

简单介绍了多元硼化物基金属陶瓷的发展历程。对其制备工艺、各种性质以及应用作了比较详细的论述。

A new process of preparing anhydrous boric oxide by dehydration of boric acid in a fast fluidized bed

硼酸快速流态化热分解制硼酸酐的新工艺

Study on Hydrothermal Synthesis Process of Magnesium Borate for Special Glass

特种玻璃用硼酸镁的水热合成工艺研究

Based on the success of booster power inverter used in the tank, this paper illustrates the designing process and key parameters of the boosting transformer.

针对一种装甲车辆用升压电源的成功研制，详细介绍了关键元器件一一升压变压器的设计步骤及关键参数的计算。

Study on Irregular Booster Pellet Charge Process

异形结构传爆药装药工艺研究

To provide anatomical data for local blocking treatment and the needle knife therapy-through investigating features and classification of the bony structure of styloid process of radius. 2.

观测桡骨茎突部骨性结构的特点及分型，为临床局部封闭及针刀治疗提供解剖学依据。观测桡骨茎突部软组织结构的特点及变异，为临床局部封闭、针刀等治疗提供解剖学依据。

Clinical and anatomic observation on the relation between bony process and stenosing tenovaginitis

骨性突起与狭窄性腱鞘炎相关解剖学的临床研究

External auditory canal and mastoid process were involved in 10 cases, squamous and petrous parts in 8 cases, and middle ear in 7 cases on CT scans. Destruction of ossicles and bony labyrinth were detected in 2 cases, respectively.

CT发现10例都累及外耳道和乳突，8例并累及岩部和鳞部，7例累及中耳，听小骨及内耳骨迷路破坏各2例。

Study on the Preparation and Ball Bonding Process for the High-Performance Copper Bonding Wire

高性能键合铜丝的制备及其球键合工艺研究

Study on Process Model of Ultrasonic Bonding

超声焊接的研究和工艺模型

Evolution of the Bond Interface During Ultrasonic Wedge Bonding Process

超声楔键合过程界面接合部演化规律研究

In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.

文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。

Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

Effect of process parameters and interlayer on properties of 1420 Al-Li alloy diffusion bonded joint

1420铝锂合金扩散焊工艺及中间层材料对接头性能的影响

Firstly, by following 40V bipolar process the device can be inexpensive in cost and small in size.

首先采用40V双极型工艺可降低芯片的成本和面积；

The indexes were compared with those ones in gold electrolyte preparation with bisque firing crucible process.

阴离子交换膜在金电解造液过程中的技术指标，其优于素烧坩埚金电解造液技术指标。

Study of a New Manufacturing Process of High Purity Bismuth Oxide

一种制备高纯氧化铋工艺的研究

The Preliminary Study on Drying Process Traverse Strains of Asian White Birch

白桦木材干燥过程横纹流变特性的初步研究

Ion implantation technique for the fabrication of very high-speed bipolar circuits is discussed in the paper, with emphasis on the ion implantation doping and shallow junction formation and the annealing of the implanted layer in bipolar device process.

本文讨论了高速双极器件制造中的离子注入技术。重点讨论在双极器件制造工艺中的离子注入掺杂技术，离子注入形成浅结技术，以及离子注入层的退火技术。

The photodegradation process could be well described by a four-parameter biphasic first-order reaction kinetic model, and showed obvious rapid and slow photodegradation phases, the latter was the rate determining step.

4参数2室一级反应动力学模型可以很好地描述同时洗脱和光催化降解土壤中硫丹的过程，包括快速光降解和慢速光降解两个阶段，后者是整个降解过程的速度控制步骤。