solder的例句大全

1、

Do not use any warming device to heat up the solder paste.

切忌用加热工具对焊接材料进行加热.
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2、

Used with the solder wire together, soldering a stainless steel etc metal.

同锡线一起使用, 焊接不锈钢等难以上锡的金属.
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3、

Is the average and range of Solder Paste height measurements SPC controlled?

锡膏厚度测量的平均值和间距SPC是否受控?
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4、

The solder wire should attain the standard provision deflection and pitch by straightening.

焊丝经校直应达到标准规定的挺度和翘距.
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5、

Hand solder is recommended instead of reflow solder.

不建议使用回流焊,推荐使用手动焊接.
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6、

Titanium alloy solder bath : suitable for lead – free solder.

防腐蚀钛合金炉胆: 适用无铅工艺,寿命长. (先配项)
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7、

Is the upper and lower specification limits for individual Solder Paste height measurements also defined?

单点锡膏厚度测量是否定义了其控制上限和下限?
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8、

Influence of Cu on microstructure of soldered joint in Al brazing with rapid-solidifying Al-Cu solder

快速凝固Al-Cu钎料钎焊铝Cu对钎缝组织的影响
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9、

Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint.

皂化剂中所含成分, 若不采用适当的抑制剂, 将会侵蚀金属表面, 造成焊点钝化.
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10、

Solder paste, screen printing, use ways, printing process course will decide the printing quality.

在锡膏印刷工艺中,锡膏、丝印机、锡膏使用方法和印刷工艺过程将影响到印刷质量.
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11、

Use only with production equipment specifically designed for use with solder paste.

于专为锡膏设计的设备中使用.
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12、

The quality of solder joint affects the reliability of the products produced by SMT directly.

由表面组装技术(SMT) 形成的产品,其焊点质量直接影响到产品的可靠性.
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13、

Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling

CBGA结构热循环条件下无铅焊点的显微组织和断裂
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14、

A study on a module to solve the problem of the inefficiency of vacuum brazing with silver based solder.

针对多年来银基钎料真空钎焊效果不佳的问题，以一组件为例进行研究。
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15、

Study on vacuum brazing with silver based solder

银基钎料真空钎焊效果的研究
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16、

Application of Ag-Cu-P Brazing Solder with Negligible Content of Silver to a Electric Machine

Ag-Cu-P系列低银钎料在电机上应用
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17、

Development on High-frequency Induction Brazing Solder of Al/ 45 Steel

Al/45钢高频感应钎焊焊料的研制
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18、

Experimental Research on Torch Brazing Solder for Al-Cu Joint Welding

铝－铜火焰钎焊材料研究
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19、

The paper explains the experiment of smelting silver based electric contact materials and silver based solder by medium-frequency induction furnace with graphite and clay crucible. It compares the effects of the two type crucibles on the compositions of the melted materials.

分别用石墨坩埚和粘土坩埚对银基电触头材料和银基钎料进行中频熔炼试验，比较两种坩埚对所熔炼材料成分的影响。
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20、

The Study of Solder Bridge in Fine Pitch Devices

细间距器件焊点桥接研究
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