solder的例句大全

1、

The operator should use the solder paste quickly after it has been taken out.

取出的锡膏要尽快实施印刷使用.
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2、

Familiar with lead-free solder paste and at least 3 years related sales experience.

熟悉无铅锡膏产品及市场,具备3年以上行业销售经验.
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3、

To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.

为了获得要求的凸起高度, 锡膏在晶片焊盘过焊.
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4、

Is the upper and lower specification limits for individual Solder Paste height measurements also defined?

单点锡膏厚度测量是否定义了其控制上限和下限?
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5、

Solder paste, screen printing, use ways, printing process course will decide the printing quality.

在锡膏印刷工艺中,锡膏、丝印机、锡膏使用方法和印刷工艺过程将影响到印刷质量.
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6、

Use only with production equipment specifically designed for use with solder paste.

于专为锡膏设计的设备中使用.
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7、

The quality of solder joint affects the reliability of the products produced by SMT directly.

由表面组装技术(SMT) 形成的产品,其焊点质量直接影响到产品的可靠性.
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8、

Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint.

皂化剂中所含成分, 若不采用适当的抑制剂, 将会侵蚀金属表面, 造成焊点钝化.
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9、

Transition fittings are available for adapting to new or existing threaded or solder joint ends.

还可提供转换管件,用于适配新的或现存的螺纹或焊料连接端口.
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10、

Supper Roughening Process Improves Solder Mask Peeling of Immersion Tin

超粗化前处理工艺改善沉锡板阻焊剥离
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11、

Using a manual or pneumatic dispensing device, apply the solder paste to the pads.

使用手动或气动刷锡设备把锡膏刷到焊盘上.
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12、

In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip and substrate by experiment and3D mold flow simulation.

文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
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13、

With extensive application of fine pitch QFPs and BGAs, precisely and accurately determining and adjusting PCB's temperature profile is necessary to promote solder quality.

目前由于QFP和BGA等器件的大量采用，如何准确地测试、调整印制板温度曲线是提高焊接质量的关键。
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14、

Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL.

主要研究了不同氧含量对QFP引脚焊点拉伸强度的影响，得到一个最佳的氧含量范围。
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15、

The 3D shape prediction models and the 3D finite element analysis models of all the 25 QFP solder joints were developed.

建立了这25种焊点的三维形态预测模型和三维有限元分析模型；
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16、

Effect of temperature cycling stress profile on the thermal fatigue life of solder joints of QFP

温度循环应力剖面对QFP焊点热疲劳寿命的影响
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17、

Shape prediction and reliability analysis of QFP solder joint

QFP焊点形态预测及可靠性分析
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18、

Study on Liquid Alkali Developing Type Solder Resists: Reaction Between Dibasic Acid Half-ester with Epoxy Compound

碱水显影阻焊油墨研究&羧基与环氧基的反应熊果酸酯的合成研究
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19、

Solder-paste printing plays an important in SMT production, and affects the quality of assemblies.

SMT生产工艺决定了电子产品的可靠性, 焊膏印刷质量的好坏是其关键因素之一.
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20、

Effect of Solder Paste Volume on Reliability of CBGA Assemblies

焊膏厚度对CBGA组装板可靠性的影响
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