芯片的例句大全

This paper is divided the chip circuit into point multiplication and point add double point and finite field operation module, and respectively the circuit optimization for three different operation on characteristics.

本文把芯片电路分为点乘模块、点加倍点模块和有限域运算模块，并且针对这三种模块的不同运算特点分别作了电路优化。

The Design of High Frequency Fluorescent Lighting Ballasts IC

高频荧光灯镇流器芯片的设计

The control chip controls the indicator light circuit and the button circuit through an I/ O port for realizing the function of man-machine switching.

控制芯片通过I/O口控制指示灯电路和按键电路，实现人机交换功能；

Analysis on differential expression profile of cytochrome P450 genes in benzene poisoning cells using cDNA microarray

用cDNA微阵列芯片检测苯中毒细胞色素P450基因表达差异

Firstly, by following 40V bipolar process the device can be inexpensive in cost and small in size.

首先采用40V双极型工艺可降低芯片的成本和面积；

Like every other chipmaker on the planet, NVIDIA ( NVDA) is making a big bet on mobile.

像全球其它芯片制造商一样，英伟达（Nvidia）公司也把赌注压在了移动业务上。

Research and Implementation of the Video Decoder Based on Dual-Core DSPs

基于双核DSP的视频解码芯片驱动研究与实现

A brief survey is given to the new advances of MPEG-2 video decoder chips.

本文简要介绍应用前景广阔的MPEG－2视频解码芯片的新进展。

Design and Optimization of SDRAM Memory Interface in High-Definition Video Decoder

高清视频解码芯片中SDRAM存储器接口的设计与优化

The Implementation of Development Platform for Digital HDTV Video Decoder ASIC

数字高清晰度电视视频解码芯片开发平台的研制

But the technology for such chips is no longer the stuff of science fiction.

但是这种芯片已不再只是出现在科幻小说里虚构的内容了.

Establish a discriminant equation based on the glioma cDNA microarray expression data combined with statistical methods to predict and judge glioma samples. 3.

依据cDNA胶质瘤表达谱芯片数据结合统计学方法建立判别方程，对胶质瘤样本进行预测和判断。

Design of a Vacuum Adsorption Dumping Gear for Flip Chip

真空吸附式倒装芯片翻转机械手设计

It offers tools to make it easier to develop software for its chips.

Nvidia提供工具来使得为其芯片开发软件变得更容易.

Nvidia, whose chips are used in self-driving technology, has seen its shares triple in a year.

英伟达（Nvidia）的股价一年间上涨了两倍，其生产的芯片被用于自动驾驶技术。

With the development of IC packaging technology, flip chip is widely used.

随着集成电路封装技术的发展, 倒装芯片技术得到广泛的应用.

One layer, for example, would be able to pick out edges, while another picks out color.

例如某一层的CNN芯片能够辨认出物体的边缘, 而另一层能辨别出色彩.

The results indicated that infrared radiation could significantly enhance the on-chip proteolysis and the digestion time was substantially reduced to 5 min.

结果表明，红外线照射能够显著增强芯片上蛋白酶解，酶解时间显著缩短到了5min。

Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性.

In the aspect of dispersion for power LEDs, flip-chip configuration has potential predominance.

与正装LED相比, 倒装焊芯片技术在功率型LED的散热方面具有潜在的优势.