Whatever shapes of solder joints, under the thermal loading, the distribution of the largest equivalent Von Mises stress/ strain are all approximately same which is in the brim of solder close to the joint of solder and PCB.

  • 研究发现,在热载荷作用下,鼓形、凹形及柱形钎料焊点的最大应力应变分布大致相同,均在钎料球的外边缘。

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