材的例句大全

Influence of surface strain of thin-film ( substrate) and related references of the roll on printing board to coating leveling is studied.

考察了薄膜基材表面张力、印刷版辊相关参数对涂层流平性的影响。

The copper foil board base paper is the fundamental material to product the paper of printing line board, and also is a kind of higher degree special industrial paper.

覆铜箔层压板原纸是生产印刷线路板用全纸基覆铜箔层压板的基础材料，是一种生产难度较高的特种工业用纸。

The article consider that the Key point is the quality of raw materials and parts, the important factors were process control and manufacture management.

原材料和零配件的质量是关键，而工艺控制与生产过程的管理是最重要的因素。

In the manufacture procedure of pressure vessel, the residual stress concentration may exist due to the causes of material selection, fabrication and welding.

在压力容器制造过程中，由于选材、加工及焊接等原因造成残余应力集中；

On the base of studying structure format of elastic unit and by introducing the principle of resistance strain sensor, principle of mechanism and mechanics of materials, we have developed a new torque sensor which is small in volume and has simple manufacture procedure.

利用电阻应变传感器原理、机械原理、及材料力学知识，在对传感器弹性元件结构形式研究的基础上，研制出加工工艺简单、体积小的扭矩传感器。

In the passing month, it was usual to be seen that selling price lower than manufacturer's price in Shenyang steel market.

近一个月以来，销售价低于出厂价的“倒挂”情形，在钢材市场里时有发生。

Facing the domestic and foreign steep market competition as well as the consumers' higher and higher request, we should strengthen discipline research and use the high and new technology to speed up our country's fitness equipment's development.

面对国内外市场激烈竞争的需求以及广大消费者越来越高的要求，应加强学科研究，采用高新技术来加快我国健身器材的发展。

Liuzhou Cement Plant A Backbone Enterprise in the Building Material Industry

建材工业的脊梁&柳州水泥厂

You know another really good business? Teeny tiny baby coffins.

知不知道还有一种生意也相当好？婴儿棺材。

Low k Materials for ULSI Application

低介电常数材料在超大规模集成电路工艺中的应用

Process Integration of Low k/ SiC Materials with Cu Interconnects

低k/碳化硅材料与铜互连线的工艺整合

There are two pairs of competitive factors in the F doped porous low k silicamaterials: porous and mechanical strength, porous and electrical property.

在低k的多孔掺F氧化硅材料当中，存在着两对竞争因素：多孔与机械强度，多孔与电学性质。

Nowadays, in the manufacturing of microelectronic components fluorocarbon plasma was widely used in low K a-C: F: H film deposition and the etching of SiO_2, Si and other related materials.

目前，碳氟等离子体被广泛用在器件的微细加工过程中，如沉积低介电常数的氟化非晶碳薄膜，刻蚀SiO2、Si以及其它相关材料。

Metal materials-special metal sheets, the High Line and the plating Hongtong slingshot slingshot line.

金属材料 - 特殊金属片 、 高级弹弓线及镀红铜弹弓线.

Firstly, why to introduce the high k materials in the blocking layer is introduced.

首先阐明了引入高k材料做阻挡层的原因。

Fabrication and Investigation of High K Gate Dielectric Materials for Next Generation MOSFET Applications

应用于下一代MOSFET中的高介电栅介质材料的研究

And the simulation results are very important, for they could provide systematic guidance for applications of high K gate dielectrics into devices.

模拟结果将为高K介质材料的应用提供参考。

High k Gate Dielectric Materials and Si Nanotransistor ( Continued)

高k栅极电介质材料与Si纳米晶体管（续）

The details are presented below: 1. The electrical property of Hf-based high k materials.

具体如下：1.Hf基高k材料的电学性质。

One method is to use the stacked high k blocking layer, which could combines advantages of different high k materials.

一种是采用堆叠的高k阻挡层。这样可以兼具多种高k材料的优点。