芯片的例句大全

A brief survey is given to the new advances of MPEG-2 video decoder chips.

本文简要介绍应用前景广阔的MPEG－2视频解码芯片的新进展。

Design and Optimization of SDRAM Memory Interface in High-Definition Video Decoder

高清视频解码芯片中SDRAM存储器接口的设计与优化

The Implementation of Development Platform for Digital HDTV Video Decoder ASIC

数字高清晰度电视视频解码芯片开发平台的研制

But the technology for such chips is no longer the stuff of science fiction.

但是这种芯片已不再只是出现在科幻小说里虚构的内容了.

Establish a discriminant equation based on the glioma cDNA microarray expression data combined with statistical methods to predict and judge glioma samples. 3.

依据cDNA胶质瘤表达谱芯片数据结合统计学方法建立判别方程，对胶质瘤样本进行预测和判断。

Design of a Vacuum Adsorption Dumping Gear for Flip Chip

真空吸附式倒装芯片翻转机械手设计

It offers tools to make it easier to develop software for its chips.

Nvidia提供工具来使得为其芯片开发软件变得更容易.

Nvidia, whose chips are used in self-driving technology, has seen its shares triple in a year.

英伟达（Nvidia）的股价一年间上涨了两倍，其生产的芯片被用于自动驾驶技术。

Like every other chipmaker on the planet, NVIDIA ( NVDA) is making a big bet on mobile.

像全球其它芯片制造商一样，英伟达（Nvidia）公司也把赌注压在了移动业务上。

The complaint said the problems were due to faulty graphics cards produced by Nvidia, a chipmaker which supplies several PC makers with this component.

申诉表示，这些问题的根源在于英伟达（Nvidia）生产的显卡有问题。英伟达是一家芯片制造商，向多家个人电脑厂商供应这一部件。

Chipmaker NVIDIA ( NVDA) recently touted real-time face-rendering at its GPU Technology Conference in California.

芯片制造商英伟达（NVIDIA）最近在该公司于加利福尼亚召开的GPU技术大会（GPU Technology Conference）上大力鼓吹实时面部渲染技术。

Ward sees the Shield console as an innovative product that also serves as an example of what can be done with Nvidia's Tegra chips and Grid streaming technology.

沃德认为“盾”是一款创新产品，也是用来证明英伟达图睿芯片和Grid流媒体技术实力的绝佳例证。

With the development of IC packaging technology, flip chip is widely used.

随着集成电路封装技术的发展, 倒装芯片技术得到广泛的应用.

In the aspect of dispersion for power LEDs, flip-chip configuration has potential predominance.

与正装LED相比, 倒装焊芯片技术在功率型LED的散热方面具有潜在的优势.

Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性.

The results indicated that infrared radiation could significantly enhance the on-chip proteolysis and the digestion time was substantially reduced to 5 min.

结果表明，红外线照射能够显著增强芯片上蛋白酶解，酶解时间显著缩短到了5min。

One layer, for example, would be able to pick out edges, while another picks out color.

例如某一层的CNN芯片能够辨认出物体的边缘, 而另一层能辨别出色彩.

In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip and substrate by experiment and3D mold flow simulation.

文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。

In addition, the chip and antenna connection can also affect the cost.

另外, 芯片和天线的连接方式也会影响其成本.

In this paper, research and development were carried out on manufacturing a unit chip structure, which is called integration injection logic ( hereinafter referred to as IIL) using a special process.

本文以实际生产制造过程中，某芯片采用的一种特殊工艺单元结构集成注入逻辑为研究对象，对该单元器件的功能以及如何实现并优化大规模加工工艺进行探究。